| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation by increasing planarity of the bottom surface of a recessed portion, which is a semiconductor mounting portion, as compared with a conventional one. SOLUTION: This hest sink 10 for semiconductor is composed of a laminate of a plurality of metallic thin plates 20, 30. Punched out portions 21 punched in the thickness direction are formed in one metallic thin plate 20 thereof. Therefore, a recessed portion 40 for mounting a semiconductor is formed by an inner side surface of the punched portion 21 and a flat surface of the metallic thin plate 30 exposed in a state of being surrounded by this inner side surface. Consequently, since the flat surface of the metallic thin plate 30, having small surface roughness becomes a bonding surface brought into contact with the semiconductor, a contact area between the flat surface and semiconductor can be made larger than in conventional cases, and heat dissipation is improved.
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