| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor which is excellent in flame-retardancy and high temperature reliability and gives a sealing material excellent in moldability. SOLUTION: A semiconductor element is sealed with an epoxy resin composition for sealing a semiconductor, which comprises as essential ingredients an epoxy resin (A), a curing agent (B), a curing accelerator (C), an inorganic filler (D), an ion scavenger (E), a bromine-containing compound (F) and antimony tetroxide (G), wherein the curing accelerator is an adduct of a tertiary phosphine to a quinone compound, the ion scavenger is a hydrotalcite compound represented by the formula (in the formula, 0<X<0.5; and (m) is a positive integer) and compounded in an amount of 0.01-10 wt.% based on the whole composition, and antimony tetroxide is compounded in an amount of 0.01-10 wt.% based on the whole composition.
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