发明名称 HEAT TREATMENT SYSTEM AND HEAT TREATMENT UNIT TO BE USED IN THE SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment system where more suitable control conditions (recipe) for sequence control can be developed at a low cost, in a short term and heat treatment units. SOLUTION: A heat treatment system is provided with a plurality of heat treatment units, having heater plates 51 which heat boards W up to a prescribed temperature. At least one of the plurality of heating treatment units is a temperature measuring unit (M.HP) having a substrate 61 for temperature measurement, in which a plurality of temperature sensors 60 are attached and which is arranged so as to be mounted on the heater plate. The heat treatment system is also provided with a recording means 64 for recording outputs of the temperature sensors attached on the substrate 61 for temperature measurement.
申请公布号 JP2001102275(A) 申请公布日期 2001.04.13
申请号 JP19990274610 申请日期 1999.09.28
申请人 TOKYO ELECTRON LTD 发明人 SHIRAKAWA HIDEKAZU;FUKUOKA TETSUO
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
代理机构 代理人
主权项
地址