MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for efficiently eliminating an insulation resin tie bar being formed for protecting an outer lead after the resin sealing of a semiconductor chip. SOLUTION: By using a lead frame where a constriction part 12a with a smaller dimension than the width of an outer lead 12 and a larger dimension than the width of an insulation resin tie bar 14 in the longitudinal direction of a lead is provided at the part of the outer lead 12 outside the insulation resin tie bar 14 being provided at the part of the outer lead 12 of a lead frame 11, a high-pressure water current 17 is sprayed from the upper and lower portions of the insulation resin tie bar 14 for eliminating an insulation resin tie bar 14a adhering to the surface of the outer lead 12. At the same time, an insulation resin tie bar 14b that remains while being sandwiched between the outer leads 12 is moved to a space part 15 between the constriction parts 12a of the adjacent outer leads by spraying the high-pressure water current 17.