| 摘要 |
PROBLEM TO BE SOLVED: To provide structure that dissipates heat from an electronic element via a metal plate and is securely bonded to the electronic element. SOLUTION: A heat pipe 2 is partially mounted along a metal plate 1 for dissipating heat. Also, a heat reception block 6 that projects in the thickness direction of the metal plate 1 for dissipating heat and becomes a contact region with an electronic element 9 is mounted on the other parts of the heat pipe 2, so that it can receive and send heat. Further, an elastic body 7 is provided between the heat reception block 6 and the metal plate 1 for dissipating heat.
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