| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package substrate which meets the requirements for lighter, thinner, and smaller substrate. SOLUTION: An independent copper circuit pattern comprising no lead wire for partial electrolytic plating is formed, and a solder resist pattern is formed while the surface of solder resist is roughened. The electroless copper is deposited on the entire surface of substrate, and the solder surface is coated with a plating resist pattern before the electroless copper exposed on the part surface and solder surface is dissolved and removed by etching. The pad of part surface, copper-plated through hole, ball pad of solder surface, and electroless copper of solder surface are used as a conductor to deposit a partial electrolytic plated coat at the exposed copper pad. After the plating resist of solder surface is removed, the electroless copper of solder surface is dissolved by etching to form a semiconductor package substrate comprising the pad of electrolytic plated coat.
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