INSPECTION BOARD

摘要

PROBLEM TO BE SOLVED: To contrive the coexistence of the shortness of a current path between the outer lead of a semiconductor device and the wiring of an inspection board and the absorption of the irregularity of the height of the outer lead of the semiconductor device. SOLUTION: A plurality of pieces of wiring 11 are formed on the surface of a wiring board 10 having elasticity. An opening 10a is formed on an area opposed to the semiconductor device A in the wiring board 10, and a plurality of breaks 12 are passed between the pieces of the wiring 11 from the opening 10a to be radially formed.