发明名称 DIE BONDER
摘要 PROBLEM TO BE SOLVED: To provide a die bonder having an inexpensive and simple constant pitch feed mechanism of lead frame in which high speed feeding can be ensured while sustaining high positioning accuracy without relying upon a pin feed system. SOLUTION: Pins 31 are stood, at the same pitch as the feed holes 2 of a lead frame 1, on a belt 30 wound about four pulleys 32a-32d and the lead frame 1 is fed at a constant pitch by turning or stopping the belt 30 with the pins 31 being engaged in the feed holes 2. Two pulleys 32b, 32c are stretched at a tension regulating section 35. Furthermore, a PP unit 40 is provided while passing through the wound belt 30 in order to make clear the layout on the periphery of the PP unit 40 and to make the PP unit 40 more compact while sustaining rigidity.
申请公布号 JP2001127082(A) 申请公布日期 2001.05.11
申请号 JP19990363662 申请日期 1999.12.22
申请人 NEC MACHINERY CORP 发明人 MIYAZAKI KENTARO
分类号 H01L21/52;H01L21/50;(IPC1-7):H01L21/52 主分类号 H01L21/52
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