| 摘要 |
The invention relates to a machine for processing wafers, comprising several production units (2) and measuring units (3) and a transport system for transporting the wafers. A transport control unit (9) is arranged in the transport system, which comprises a means of storing the processing sequence of the wafers. Control commands are generated in the transport control unit (9), as a function of these parameters, and may be issued to the transport system for controlling the execution of the transport of the wafers.
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