MOUNT FRAME FOR BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A mount frame for a ball-grid-array(BGA) package is provided to make mount frames separated to individuals and transferred when the mount frame is unloaded by a transfer unit, by installing an adhesion preventing protrusion to form an isolating space between mount frames. CONSTITUTION: A semiconductor chip is attached to one side surface of a land pattern, and a solder ball is attached to the other side surface of the land pattern. A base film having the land pattern is temporarily fixed by an adhesion unit. At least one adhesion preventing unit(117) is located in a predetermined position of the outer portion of the adhesion unit, protruded higher than the thickness of the adhesion unit.