发明名称 |
PLATING PRETREATMENT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a plating pretreatment device which is capable of uniformly passing a plating pretreating liquid between a cathode and work and is applicable to a cylinder block of multiple cylinders as well. SOLUTION: This plating pretreatment device is disposed with the cylindrical cathode 10 within a fixing jig 3 internally formed with a hollow part, is loaded with the cylindrical work 17 in the fixing jig 3 and is arranged with the cathode 10 within the work 17. The lower cathode 40 of the cathode 10 is made finer than the upper cathode 41 and the upper cathode 41 and the lower cathode 40 are made dividable. The hollow parts and cathodes 10 of the fixing jig 3 are disposed in a plurality and thermometers 25 are disposed at each of the respective cylinders.
|
申请公布号 |
JP2001200391(A) |
申请公布日期 |
2001.07.24 |
申请号 |
JP20000009599 |
申请日期 |
2000.01.19 |
申请人 |
SUZUKI MOTOR CORP |
发明人 |
KURODA TETSUYA;KATO HIDESUMI |
分类号 |
F02F1/00;C25D5/34;C25D7/00;C25D17/12;C25F3/02;C25F7/00;(IPC1-7):C25D7/00 |
主分类号 |
F02F1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|