| 摘要 |
<p>A copper foil excellent in laser beam drilling performance, which comprises a layer formed on a laser beam irradiation surface and containing at least any one kind of material out of indium, tin, cobalt, zinc, cobalt alloy and nickel alloy, and which is easy to laser-machine and suitable for forming a small-diameter, interlayer connection hole by means of an improvement in copper foil surface during a printed circuit board production; and a production method therefor.</p> |
