METHOD OF MEASURING STEP, METHOD OF MANUFACTURING STAMPER, STAMPER, METHOD OF MANUFACTURING OPTICAL DISK, OPTICAL DISK, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND STEP MEASURING INSTRUMENT

摘要

PROBLEM TO BE SOLVED: To provide a method of measuring step, with which the steps of projections and recessed parts formed on the surface of an object to be inspected can be measured in a short time by hardly requiring the exchange of consumables and scratching the surface of the object by solving the problem, where the steps are measured by the AFM which uses a probe for scanning the surface with the measurement taking time and may scratch the surface and the probe must be exchanged by another probe, when the probe is broken. SOLUTION: This method of measuring step includes a step of projecting probe light upon the whole or partial surface of the object on which projections and recessed parts are formed, a step of measuring the spectral reflectance waveform of reflected light from the surface of the object, and a step of calculating the projections steps and recessed parts, by fitting the spectral reflectance waveform to a reference waveform.