| 摘要 |
PROBLEM TO BE SOLVED: To facilitate an inspection of a connecting state by forming a solder fillet between a flexible printed board (FPC) leading end and a circuit board (PCB) connecting pattern, and enhancing a connecting strength in a method for solder connecting the FPC to the PCB. SOLUTION: A paste solder is printed on the connecting pattern 2 of the circuit board (PCB) 1 by a solder printer by using a screen mask 3. An another mounting component is temporarily fixed to the PCB 1 coated with the paste solder. Reflow soldering is conducted in a reflow furnace. Thus, the other mounting component is mounted on the PCB 1. The solder on the pattern 2 is melted and solidified to form a spare solder. An FPC 6 is superposed at a positional relation as shown on the spare solder of the PCB 1 and positioned, and heat press bonded by a heat press bonding machine. When the spare solder is melted and soldered, the solder fillet is formed between the leading end of the FPC 6 and the leading end of the pattern 2.
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