发明名称 COMPONENT MOUNTING BOARD, BOARD FIXING METHOD AND METHOD OF MANUFACTURING COMPONENT MOUNTING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a component mounting board capable of enabling a positive continuity between a screw head and a copper foil land. SOLUTION: In the component mounting board 10, the copper foil land 2 identical to those in a conventional technique is provided around fixing holes 1 provided at least four corners, and solder regions 3 being protruding ridge shape are formed in the land 2. The solder regions 3 are formed during a step of cream solder printing on the pads on a surface mounting component, and cream solder is adhered on the solder regions 3. After completing the step of cream solder printing, the board is subjected to a reflow step to heat the surface of the board, thereby the cream solder on the solder regions 3 swells so as to form a protruding ridge shape by surface tension of the cream solder. When the screw is tightened, the screw head presses and crashes the solder regions 3, and a contact area between the screw head and the solder regions 3 is increased, and thus, the screw head electrically contacts the solder regions 3 positively. In this way, variations in voltage of a GND layer of the board 10, and operations of circuits on the board 10 can be stabilized.
申请公布号 JP2001251029(A) 申请公布日期 2001.09.14
申请号 JP20000062096 申请日期 2000.03.07
申请人 SEIKO EPSON CORP 发明人 MIMURA KATSUTO
分类号 H05K3/34;H05K1/02;H05K1/18;(IPC1-7):H05K1/02 主分类号 H05K3/34
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