摘要 |
PROBLEM TO BE SOLVED: To provide a device for supporting a work and its supporting method by which the work can be held in stable position. SOLUTION: In a device for supporting a work which supports a carrier 3 provided with a housing 3a for housing a package 4 to which a semiconductor chip is mounted, a recessed part 2a whose outer periphery is left and surface is removed is provided on the upper surface of a supporting member 2 which is brought into contact with the lower surface of the carrier 3 and positions the carrier 3. While the carrier 3 is placed on the supporting member 2, the carrier 3 is sucked in vacuum through a suction hole 2c, thereby producing a sucked space between the recessed part 2a and the lower surface of the carrier 3. This vacuum suction makes the carrier to be sucked in vacuum, and the package 4 in the housing part 3a is sucked in vacuum through a suction hole 3b of the housing part 3a so that the package 4 is held in position. Thus, the package 4 can be held in position in such a stable state where the warpage of the carrier 3 is corrected.
|