发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor device, which can easily and accurately secure uniformity of processing liquid and the stability of concentration, even if the processing liquid of low concentration is mixed and can perform a high accurate wet processing. SOLUTION: Plural types of chemicals and water are supplied to a processing bath 1 as processing liquid 3. An ultrasonic wave oscillator 8, fitted below an ultrasonic wave water tank 7, is made to oscillate for a fixed time. Convection is generated in processing liquid 3 by the vibration of an ultrasonic wave. Processing liquid 3 is uniformized, and the concentration is stabilized. A semiconductor wafer 10 is immersed in a processing liquid 3 in the processing tank 1 and it is cleaned or etched, after the ultrasonic wave oscillator 8 is stopped.
申请公布号 JP2001284318(A) 申请公布日期 2001.10.12
申请号 JP20000100155 申请日期 2000.04.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 ANABUKI KAZUTOSHI;NOMOTO TAKUYA
分类号 H01L21/306;H01L21/304;(IPC1-7):H01L21/306 主分类号 H01L21/306
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