SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can be made thin and can provide a required flexibility even at a selected location at the time of mounting. SOLUTION: A wiring pattern 23 is formed on one surface of a flexible base substrate 21 through an adhesive layer 22, a semiconductor element 30 is mounted in a device hole made in the base substrate 21 so as to be electrically connected to the wiring pattern 23, and flexible insulating layers 24 and 25 are provided so as to hold the element-mounted substrate between its both sides. The insulating layer 25 is formed with openings at locations corresponding to terminal formation parts of the wiring pattern 23. External connection terminals 26 are joined to the terminal formation parts of the pattern 23 exposed from the openings of the insulating layer 25.