A soldering flux includes a non-acidic resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board.
申请公布号
WO0139922(B1)
申请公布日期
2001.11.15
申请号
WO2000US32720
申请日期
2000.12.01
申请人
FRY'S METALS, INC. D.B.A. ALPHA METALS, INC.
发明人
ARORA, SANYOGITA;SCHNEIDER, ALVIN, F.;TELLEFSEN, KAREN, A.
