| 发明名称 |
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE |
| 摘要 |
<p>An electronic device capable of being connected, with high reliability, to a conventional circuit board using Pb-free solder as the substitute of Sn-37Pb solder, wherein solder paste (4) is fed onto the inner side of the wiring pattern (3) on the circuit board (1) in V-shape, recessed-shape, or projected-shape, and the solder paste is connected to a semiconductor device (2), whereby the electronic device with high reliability of connection can be provided.</p> |
| 申请公布号 |
WO0197580(A1) |
申请公布日期 |
2001.12.20 |
| 申请号 |
WO2001JP04891 |
申请日期 |
2001.06.11 |
| 申请人 |
HITACHI, LTD.;ISHIDA, TOSHIHARU;SOGA, TASAO;SHIMOKAWA, HANAE;NAKATSUKA, TETSUYA |
发明人 |
ISHIDA, TOSHIHARU;SOGA, TASAO;SHIMOKAWA, HANAE;NAKATSUKA, TETSUYA |
| 分类号 |
H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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