| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed solder inspection device which can quickly and easily inform an inspector of the formed state of solder balls on a printed board in detail and, accordingly, can improve the manufacturing quality of the printed board. SOLUTION: A sensor head 20 is positioned oppositely to the printed board and detects the displacement of the solder balls. An itemized computing means 36 computes the arranging position, height, area, and volume of each solder ball based on three-dimensional data obtained from the displacement detected by means of the sensor head 20 and the scanning position of the head 20. A state discriminating means 37 discriminate the formed state of each solder ball with respect to the height, height unevenness, volume, and defects by comparing the computed results of the computing means 36 with a database DB. A displaying means 39 causes a displaying means 40 to display the arrangement of the solder balls on the printed board obtained by means of the sensor head 20 in a plane. The means 39 also causes the displaying means 40 to display the displaying spot of each solder ball with a color which is different from a usually used color at every inspection results of the plurality of items discriminated by means of the discriminating means 37.
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