| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive paste using copper powder capable of keeping the same performance as that soon after preparation for a long time even in the storage at around room temperature as well as achieving the stabilization of a cured shape by adding flexible alkoxy group-containing modified silicone resin to thermosetting resin. SOLUTION: This conductive paste is prepared in such a way that a chelate forming material and an oxyacid capable of forming an addition salt with the chelate forming material, its partial ester or amide, containing the alkoxy group-containing modified silicone resin represented by general formula (I), (wherein, R shows a 1-4C straight chain or branched alkoxy group; m shows 2-4.), as an essential component are added to the thermosetting resin containing copper powder as the main component in the range of 0.1-0.9 moles per mole of the chelate forming material.
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