MICRO MECHANICAL PACKAGING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a packaging technology for a MEMS assembly where a MEMS device array is mounted on a silicon wafer platform. SOLUTION: A silicon chamber may is sealed airtightly. By using a package made of only silicon for the MEMS device array, the thermodynamic instability disappears substantially. The mechanical instability is also reduced by using a contact pin array in order to interconnect a silicon supporting substrate for the MEMS device to the next interconnection level. The MEMS device can be detached easily by using the contact pin array for the purpose of replacement or repairing.