发明名称 ROTATION-TYPE SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To carry out a substrate treatment uniformly in the whole range of radial direction of the rotation circle of a substrate in a substrate treatment wherein a chemical is supplied to the surface of a substrate while rotating the substrate. SOLUTION: From a plurality of nozzles 36d arranged along the radial direction of a rotation circle of a substrate 10, a chemical is supplied to the surface of the substrate 10 by delivering the chemical so that the amount of it delivered increases from the inner periphery side toward the outer periphery side. The chemical supplied to the surface of the substrate 10 is successively discharged from the surface by the centrifugal force due to the rotation of the substrate 10.
申请公布号 JP2002045732(A) 申请公布日期 2002.02.12
申请号 JP20000238582 申请日期 2000.08.07
申请人 SUMITOMO PRECISION PROD CO LTD 发明人 NAKADA KATSUTOSHI;FUJINE OSAMU
分类号 B05B1/14;B05C5/00;B05C11/10;(IPC1-7):B05B1/14 主分类号 B05B1/14
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