| 摘要 |
PROBLEM TO BE SOLVED: To provide a material useful for an insulating material for electric/ electronic parts (highly reliable sealing material for semiconductor or the like) and a laminate (printed circuit board, build up substrate or the like) and various composite materials including CFPR, an adhesive, a coating or the like by manifesting an excellent low water absorbency and flame resistance in hardened material or plastics by synthesizing and using a polyphenol which is a raw material for various plastics (a polycarbonate, a PEEK, a PPO, a polysulfone or the like) or an additive, a raw material for a thermosetting resin (an epoxy resin, a cyanate resin, an acrylate resin or the like). SOLUTION: This polyphenol, which is a polycondensate of a compound expressed by formula (1), formaldehyde and phenols and/or polyphenols, is synthesized and used for a raw material of plastics, an additive for plastics and a constituent of a thermosetting resin composition.
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