| 摘要 |
PROBLEM TO BE SOLVED: To obtain a metal cap for an electronic component capable of speeding up reduction in size of the electronic component, stably and rigidly connecting the component to a substrate or the like and enhancing sealability of the inner component. SOLUTION: The metal cap 1 for the electronic component comprises a top plate 1a, and an annular sidewall 1b extended down from an outer peripheral edge of the plate 1a so that an electronic component element is surrounded in an opening 1c surrounded by the sidewall 1b. In this cap, a width of a lower end face 1b1 of the sidewall 1b is substantially constant over an entire periphery, and the lower end face 1b1 is parallel to an upper surface of the plate 1a.
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