| 摘要 |
<p>PURPOSE: To provide a method for forming a wiring pattern together with an original plate used for the method, where a sufficient dimension precision is provided even if a wiring is formed by transfer with such wide area as wafer level while rising of a manufacturing cost is avoided. CONSTITUTION: A wiring pattern forming method is provided where a wiring pattern is formed on a water by transfer. Here, a transfer process is provided where, with a metal wiring layer 15 to be transferred, a transferring original plate 19 with such linear expansion factor as dimensional error relative to a wafer 10 is within a prescribed range when heated is press-fitted under heat to the wafer 10 so that the metal wiring layer 15 is bonded/transferred.</p> |
