发明名称 |
Apparatus for localized preform cooling outside the mold |
摘要 |
An apparatus and method for providing targeted cooling to a pre-molded article, such as a preform. A cooling pin is inserted into the preform such that it makes contact with targeted area, such as the mold gate area. This permits conductive cooling of the targeted area. The apparatus and method are particularly suited to post-mold cooling in conjunction with a robotic take-out plate.
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申请公布号 |
US2002028265(A1) |
申请公布日期 |
2002.03.07 |
申请号 |
US20010983291 |
申请日期 |
2001.10.23 |
申请人 |
OUESLATI FAISAL;BRAND TIEMO;NETER WITOLD |
发明人 |
OUESLATI FAISAL;BRAND TIEMO;NETER WITOLD |
分类号 |
B29C45/72;(IPC1-7):B29C45/72;B29C49/64 |
主分类号 |
B29C45/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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