发明名称 Resist pattern forming apparatus and method thereof
摘要 A resist pattern forming apparatus comprising a controller having a controlling portion that controls a processing of a coating and developing apparatus with a coating unit and a developing unit being provided therewith and an aligner being connected thereto, while an inspecting portion and the like measures at least one of a plurality of measurement items selected from, a reflection ratio and a film thickness of a base film and a resist film, a line width after the development, an accuracy that the base film matches with a resist pattern, a defect after the development, and so on. The measured data is transmitted to the controller. At the controller, a parameter subject to an amendment is selected based on the corresponding data of each of the measurement item such as the film thickness of the resist and the line width after the development, and the amendment of the parameters subject to the amendment is performed. As a result, the amending operation is facilitated by a reduced workload of an operator and in the same time, the appropriate amendment can be performed.
申请公布号 US2002037462(A1) 申请公布日期 2002.03.28
申请号 US20010963527 申请日期 2001.09.27
申请人 OGATA KUNIE;NISHIMUKO KOKI;TOMITA HIROSHI;KIMURA YOSHIO;UEMURA RYOUICHI;TANAKA MICHIO 发明人 OGATA KUNIE;NISHIMUKO KOKI;TOMITA HIROSHI;KIMURA YOSHIO;UEMURA RYOUICHI;TANAKA MICHIO
分类号 G03F7/16;B05C11/00;B05C11/08;B05D1/40;B05D3/00;G03F7/20;G03F7/30;H01L21/00;H01L21/027;(IPC1-7):G03C5/00;G03B13/00;G03B27/32;G03B27/52 主分类号 G03F7/16
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