发明名称 SYSTEM AND METHOD FOR PROVIDING DEFECT FREE RAPID THERMAL PROCESSING
摘要 A system and method for providing substantially defect free rapid thermal processing. The present invention includes a wafer processing system used to process semiconductor wafers into electronic devices. In accordance with the present invention, once the wafer is processed, a shield can be inserted into the reactor to a position between the reactor heating surface and the wafer. The shield causes the temperature of the wafer to be reduced. Once the temperature of the wafer has been reduced to below a predetermined critical temperature, the robot picks up the wafer and removes the wafer from the processing chamber.
申请公布号 WO0195372(A3) 申请公布日期 2002.04.04
申请号 WO2001US16710 申请日期 2001.05.22
申请人 WAFERMASTERS INCORPORATED 发明人 YOO, WOO, SIK
分类号 H01L21/26;H01L21/00 主分类号 H01L21/26
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