CLEANING DEVICE AND METHOD FOR CLEANING WAFER AFTER POLISHING

摘要

PROBLEM TO BE SOLVED: To provide a cleaning device and a method with which the cleaning efficiency of the wafer surface is still increased more, and the diffusion of the cleaning liquid and the like can be prevented effectively. SOLUTION: The diffusion of the cleaning liquid to the outer space of the device can be prevented. Also, the residue of cleaning liquid or the like on the surface of the silicon wafer can be reduced drastically, by orienting the cleaning surface of the silicon wafer downward and the cleaning efficiency can be improved.