APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To solve the problem of a plurality of semiconductor elements being difficult to be mounted, for example, on a ultra-thin circuit board. SOLUTION: This apparatus for mounting a semiconductor device where a plurality of semiconductor elements 2 are mounted on the circuit board 1 and a resin filled in the gap between the circuit board 1 and the semiconductor element 2 is cured, while pressurizing the back side of semiconductor element 2 comprises means, consisting of a pressurization block 8 and a hold block 3 that pressurize the back side of all or one part among a plurality of semiconductor elements 2 individually.