METHOD OF PLANARIZING SUBSTRATE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To easily and reliably planarize steps formed on a semiconductor substrate without using the COM method, and obtain a superior flatness over a wide area of the semiconductor substrate surface without bringing about the process increase or cost up, thereby realizing a high speed operation with a little wiring delay. SOLUTION: Before heating to cross-link a polymer film 17, a shower head 31 of a press member having a high-flatness surface presses the surface of the polymer film 17 to planarize it, while a solvent is supplied to the surface of the polymer film 17.