METHOD AND APPARATUS FOR SUBSTRATE TREATMENT

摘要

PROBLEM TO BE SOLVED: To improve the throughput of a substrate treatment for removing a resist film from the substrate in a substrate treating method which removes organic compounds on the substrate, using an organic compound remover. SOLUTION: The substrate treating apparatus 1 supplies a removing liquid to a substrate W, spins the substrate W to once scatter off the removing liquid deposited to the substrate W with the removing liquid being not supplied to the substrate W after stopping supplying the removing liquid, and then supplies pure water to the substrate W. This eliminate or reduces a step of supplying an intermediate rinse liquid to thereby improve the throughput and reduce the cost.