METHODS AND APPARATUS FOR TREATING SEED LAYER IN COPPER INTERCONNCTIONS,申请号KR1020027004127-传众专利搜索

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发明名称	METHODS AND APPARATUS FOR TREATING SEED LAYER IN COPPER INTERCONNCTIONS
摘要
申请公布号	KR20020037368(A)	申请公布日期	2002.05.18
申请号	KR1020027004127	申请日期	2002.03.29
申请人		发明人
分类号	H01L21/768;H01L21/3205;C25D5/34	主分类号	H01L21/768
代理机构		代理人
主权项
地址

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