| 摘要 |
PURPOSE: A double die package with a heat sink is provided to guarantee a high speed operation at a high frequency and a high voltage and to prevent a breakdown phenomenon caused by stress, by including the heat sink between two semiconductor chips so that a heat radiating effect is maximized. CONSTITUTION: Upper and lower semiconductor chips(11,21) have an active surface on which bonding pads(12) are formed and a lower surface opposite to the active surface. Inner leads(19) are separated from the upper and lower semiconductor chips. Wires(15) electrically connect the bonding pad with the inner lead corresponding to the bonding pad. A package body(31) encapsulates the upper semiconductor chip, the lower semiconductor chip, the wires and the inner leads. The heat sink(13) is attached to the inner lead, and the upper and lower semiconductor chips are attached to the upper and lower surfaces of the heat sink. |
