发明名称 STRUCTURE FOR COOLING ELECTRICAL DEVICE CHAMBER OF OTR
摘要 PURPOSE: Structure for cooling an electrical device chamber of an OTR(Over The Range) is provided to improve the function of a hood and an electrical device chamber by separately forming an air flow for cooling an electrical device chamber and an air flow for ventilation. CONSTITUTION: An air guide(50) is installed at the upper portion of a cavity(30). A discharge guide(55) is formed in the air guide to divide a discharge path from an intake path. The discharge path extended from the lower portion of an electrical device chamber(40) to the air guide is divided from the electrical device chamber by a side partition(45). Air is discharged through an outlet(38) formed in the front upper portion of the cavity. Air is sucked through an inlet(37) formed near the outlet. The air flowing downward in the electrical device chamber forms an air flow in the electrical device chamber and emits the heat of electrical devices. Smoke generated from a gas range is sucked through hood inlets of a base plate. Then, an exhaust fan assembly(60) provides a suction force. The sucked air is discharged through the space formed between the lower face of the cavity and the base plate by the exhaust fan assembly.
申请公布号 KR20020044457(A) 申请公布日期 2002.06.15
申请号 KR20000073872 申请日期 2000.12.06
申请人 LG ELECTRONICS INC. 发明人 CHOI, MU YEON;KIM, DAE SIK;KIM, JU YONG
分类号 F24C15/32;(IPC1-7):F24C15/32 主分类号 F24C15/32
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