发明名称 |
Method for manufacturing build-up multi-layer printed circuit board by using yag laser |
摘要 |
A method for manufacturing a build-up multi-layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via hole in the multi-layer printed circuit board, such that it can have the following advantages: the manufacturing process would become simple; the component packaging density and freedom for the design of the board would be improved; and a high speed of signal process would be ensured. The method for manufacturing a build-up multi-layer printed circuit board includes the steps of: forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process, the CCL having a copper foil on the one face thereof; stacking a resin-coated (on one face) copper foil (RCC) on the CCL with the first printed circuit pattern formed thereon, and heating and pressing this structure; irradiating a YAG laser to the board with said RCC stacked so as to form a via hole at a predetermined position by removing said RCC; carrying out an electroless and electro copper plating on the board with the via hole formed therein to form a plated layer; and forming a second printed circuit pattern on said plated layer to electrically connect the layers on which the first and second printed circuit patterns are formed.
|
申请公布号 |
US6405431(B1) |
申请公布日期 |
2002.06.18 |
申请号 |
US19990467780 |
申请日期 |
1999.12.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SHIN DONG;PARK KEON YANG;SHIN YOUNG HWAN;SUN BYUNG KOOK;JOUNG JAE HEUN |
分类号 |
H05K3/00;H05K3/46;(IPC1-7):H01K3/10 |
主分类号 |
H05K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|