| 摘要 |
In an integrated circuit structure, the improvement comprising a wire bonded Cu-pad with Cu-wire component, wherein the Cu-pad Cu-wire component is characterized by self-passivation, low resistance, high bond strength, and improved resistance to oxidation and corrosion, the Cu-pad Cu-wire component comprising: a metallization-line; a liner separating the metallization line and a Cu-alloy surrounding a Cu-pad; a dielectric surrounding the liner; and a Cu-pad bonded to a Cu-alloy wire; the Cu-wire component being characterized by self-passivation areas on: a) a dopant rich interface in between the Cu-alloy and liner; b) a surface of the Cu-pad; c) a surface of the bond between the Cu-pad and the Cu-alloy wire; and d) a surface of the Cu-alloy wire.
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