| 摘要 |
PURPOSE: A driver mounting method for PDP is provided to reduce size of the PDP device and manufacturing procedures by mounting a driver IC onto the lower plate through the use of LTCC-M(low temperature co-fired ceramic on metal) method. CONSTITUTION: A driver mounting method comprises a first step of forming a green sheet(60) onto a metal substrate(62); a second step of forming an electrode pattern onto the green sheet; a third step of forming an electrode protection layer(66) onto the green sheet so as to prevent dispersion of lead and protect the electrode pattern; and a fourth step of mounting a driver IC package(70) onto the metal substrate by aligning the driver IC package with solder balls attached to the driver IC package and melting the solder balls. |
