Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used said method

摘要

This invention aims to provide a protecting method for a semiconductor wafer which can prevent breakage of a semiconductor wafer even when a semiconductor wafer is thinned to a thickness of 200 mum or less, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method. According to this invention, there is provided a protecting method for a semiconductor wafer comprising a first step of adhering a surface protecting adhesive film for a semiconductor wafer to a circuit-formed surface of the semiconductor wafer, a second step of processing a non-circuit-formed surface of the semiconductor wafer and a third step of adhering a bonding film for die bonding to the non-circuit-formed surface of the semiconductor wafer, characterized in that the third step is performed without peeling the surface protecting adhesive film for the semiconductor wafer, and an adhesive film in which an adhesive layer is formed on one surface of a substrate film at least one layer of which is made of a resin having a melting point of 200° C. or more is used, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method.