| 摘要 |
A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 mum; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 mum. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.
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