| 摘要 |
PROBLEM TO BE SOLVED: To reduce variance in relative position precision among respective solid-state image sensing devices to an optical lens. SOLUTION: A lens array 33 which has optical lenses 34 is bonded onto one main surface of a wafer 31 where image sensors 32 are formed in array. At this point, they are bonded so that mutual positioning marks A and B meet each other, and consequently the optical lenses 34 correspond to the photodetection areas of the image sensors 32. The wafer 31 where the lens array 33 is bonded is divided according to the array of the image sensors 32 to form respective solid-state image sensing devices.
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