Electronic enclosure cooling system

摘要

A cooling apparatus using "low profile extrusions" is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication base station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion. The cooling fluid is subsequently pumped through a liquid-to-air heat exchanger, to reject the removed heat into the atmosphere, prior to being recirculated through each of the low profile extrusions.