| 摘要 |
The present invention provides a semiconductor device of the BGA configuration comprising: a wiring layer 2 arranged on a circuit substrate 1 via an insulation layer; a land metal portion 2 formed on the wiring layer 2; a solder resist 4 layered so as to cover the land metal excluding a center portion thereof and the entire surface of the circuit substrate 1; and a solder ball 5 arranged on the land metal portion defined and surrounded by the solder resist 4; wherein the land metal portion 3 has a solder ball contact surface having a groove (or a line-shaped protrusion) 7 extending continuously.
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