发明名称 METHOD OF MANUFACTURING COIL COMPONENT AND COIL COMPONENT MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a coil component, which makes uniform the covered thickness of the packaged part of the coil component, suppresses irregularity in the characteristics of the coil component and also accurately performs positioning of the coil parts of the component to the packaged part to prevent a a defective molding of the packaged part from being generated, and to provide a coil component manufacturing device. SOLUTION: A coil component manufacturing device is constituted in a structure that a coil component has a mounting mechanism of a structure that a bonding agent containing a thermosetting resin forming the packaged part of the coil component is mixed with magnetic powder in a non-heated state that the thermosetting resin is not thermoset and green compacts 15 formed by pressure-molding the mixture of the bonding agent with the magnetic powder are mounted on coil parts 12, a transfer mechanism for transfer-feeding the coil parts 12 mounted with the green compacts 15, top and bottom dies 22 and 23, which grasp terminals 14 provided on the coil parts 12 and also control the outer shape of the coil component at the time of a remolding of the coil component, and top and bottom punches 20 and 21 for repressure-molding the green compact 15 and the coil component manufacturing device is constituted of a molding die for remolding the coil parts 12 mounted with the green compact 15 transfer-fed by the transfer mechanism.
申请公布号 JP2002319517(A) 申请公布日期 2002.10.31
申请号 JP20010125462 申请日期 2001.04.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIWATARI HIDETOSHI;KITAGAWA TOMOKAZU;UEDA SATOSHI;WADA HIROSHI;TONO HIROAKI;HAMAMOTO HIROYUKI
分类号 H01F41/02;H01F41/04;(IPC1-7):H01F41/02 主分类号 H01F41/02
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