| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip mounted body having superior reliability of surface uniformity and mechanical strength, etc., and to manufacture the mounted body using relatively simple device and operations. SOLUTION: For the flip-chip mounted body, a semiconductor chip with a bump is mounted on a terminal electrode part on a substrate and a resin film covering the entire semiconductor chip is provided. In a mounting method for obtaining the mounted body, a resin film suction die 8 provided with a small hole 9 connected to a vacuum device on an upper part and provided with a void part 10 slightly large for housing the semiconductor chip, is used, the resin film 5 is lifted to the inner wall of the voice part, it is put on the semiconductor chip 1 mounted on the terminal electrode part on the substrate, then evacuation is switched to normal pressure or pressurization, heating is conducted and the resin film is made to adhere on the semiconductor chip and the substrate 2 around it.
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