发明名称 COMPONENT MOUNTING BOARD, COMPONENT MOUNTING METHOD AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To allow for arbitrary selection of surface mounting components of different size, and stabilized mounting thereof.SOLUTION: A component mounting board has a metal layer (3), on which a resist pattern is provided, and a land where the metal layer (3) is exposed for connecting the electrode of a component mounted on the board. The land consists of a pair of first land (1) and a second land (1'), which are separated by a predetermined distance and arranged to face each other. The first land (1) and second land (1') are formed of a region where the metal layer (3) is exposed except a resist coat region (2), in a rectangular region (4) where the resist coat region (2) is formed partially. The resist coat region (2) includes at least two strip regions (21) extending in the facing direction of the first land (1) and second land (1'), and the strip regions (21) are arranged at a predetermined interval in a direction perpendicular to the facing direction of the first land (1) and second land (1').SELECTED DRAWING: Figure 2
申请公布号 JP2016225559(A) 申请公布日期 2016.12.28
申请号 JP20150112886 申请日期 2015.06.03
申请人 SHARP CORP 发明人 NAKAZURU JUNICHI;MOGI ETSUKO
分类号 H05K3/34 主分类号 H05K3/34
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