发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide an electronic component having superior mounting characteristics and high reliability although its size is small. SOLUTION: The electronic component is manufactured in such a way that a conductive post is electrically connected to one electrode of an electronic component body having electrodes on both sides on a conductive land of a wiring board formed by forming the conductive land on one main surface of an insulating board, and the surface of the wiring board is coated with a resin so that the external end of the conductive post and the other electrode of the body are exposed. In this component, the electrode connected to the conductive land on the body can be compressed in the axial direction.
申请公布号 JP2002343917(A) 申请公布日期 2002.11.29
申请号 JP20010146076 申请日期 2001.05.16
申请人 NEC KANSAI LTD 发明人 IKEGAMI GORO;TOKUMOTO YUKITAKA;HIRAI TARO;SAITO TADAO
分类号 H01L23/48;H01L23/12;(IPC1-7):H01L23/48 主分类号 H01L23/48
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