发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which has excellent high frequency characteristics, and its manufacturing method. SOLUTION: The contact plug connected to a base lead-out part in a bipolar transistor of a semiconductor device is comprised of one or more slit-section (rectangular-section) metal plugs in parallel to the surface of the semiconductor device, which are extended from tiny contact regions consisting of cobalt silicide layers on a graft base to an element isolation insulating film, and arranged in the vertical direction to the long side of a rectangular section metal plug on an emitter electrode.
申请公布号 JP2002353232(A) 申请公布日期 2002.12.06
申请号 JP20010157313 申请日期 2001.05.25
申请人 NEC CORP 发明人 SUZUKI HISAMITSU
分类号 H01L29/43;H01L21/28;H01L21/331;H01L21/8222;H01L21/8248;H01L21/8249;H01L27/06;H01L29/41;H01L29/732;H01L29/737;(IPC1-7):H01L21/331;H01L21/822;H01L21/824 主分类号 H01L29/43
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